Materials for Information Technology

Devices, Interconnects and Packaging

  • Ehrenfried Zschech
  • Caroline Whelan
  • Thomas Mikolajick

Part of the Engineering Materials and Processes book series (EMP)

Table of contents

  1. Front Matter
    Pages i-xix
  2. Recent Advances in Thin-film Deposition

    1. Front Matter
      Pages 1-1
    2. D. Chrastina, B. Rössner, G. Isella, H. von Känel, J. P. Hague, T. Hackbarth et al.
      Pages 17-29
    3. J. Schuhmacher, A. Martina, A. Satta, K. Maexa
      Pages 39-50
    4. M. Joulauda, P. Doppelt
      Pages 51-59
    5. C. M. Whelan, A. -C. Demas, A. Romo Negreira, T. Fernandez Landaluce, J. Schuhmacher, L. Carbonell et al.
      Pages 69-76
    6. J. P. Gueneau de Mussy, G. Beyer, K. Maex
      Pages 77-84
    7. J. A. Kittl, A. Lauwers, O. Chamirian, M. A. Pawlak, M. Van Dal, A. Veloso et al.
      Pages 85-97
    8. J. P. Morniroli, P. H. Albarède, D. Jacob
      Pages 99-108
  3. Material Aspects of Non-Volatile Memories

    1. Front Matter
      Pages 109-109
    2. T. Mikolajick, C. -U. Pinnow
      Pages 111-125
    3. O. Winkler, M. Baus, M. C. Lemme, R. Rölver, B. Spangenberg, H. Kurz
      Pages 127-138
    4. H. Brückl, J. Bornemeier, A. Niemeyer, K. Rott
      Pages 163-176
    5. R. Bez, A. Pirovano, F. Pellizzer
      Pages 177-188
    6. S. Privitera, C. Bongiorno, E. Rimini, R. Zonca
      Pages 189-196
    7. Y. Yang, L. Ma, J. Ouyang, J. He, H. M. Liem, C. -W. Chu et al.
      Pages 197-209
  4. Materials for Interconnects

    1. Front Matter
      Pages 211-211
    2. M. Engelhardt, G. Schindler, W. Steinhögl, G. Steinlesberger, M. Traving
      Pages 213-224
    3. P. S. Ho, K. -D. Lee, J. W. Pyun, X. Lu, S. Yoon
      Pages 225-239
    4. M. Hecker, R. Hübner, J. Acker, V. Hoffmann, N. Mattern, R. Ecke et al.
      Pages 283-295
    5. D. Shamiryan, M. R. Baklanov, K. Maex
      Pages 305-314
    6. M. Nihei, A. Kawabata, M. Horibe, D. Kondo, S. Sato, Y. Awano
      Pages 315-326
    7. I. Z. Rahman, K. M. Razeeb, M. A. Rahman
      Pages 327-344
  5. Materials for Assembly/Packaging

  6. Advanced Materials Characterization

  7. Back Matter
    Pages 507-509

About this book


The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products.

Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:

materials for silicon-based semiconductor devices (including high-k gate dielectric materials);

materials for nonvolatile memories;

materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and

materials for assembly and packaging

The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.


The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.


computer development dielectrics film material materials characterization materials science modeling production science semiconductor semiconductor devices silicon technology thin films

Editors and affiliations

  • Ehrenfried Zschech
    • 1
  • Caroline Whelan
    • 2
  • Thomas Mikolajick
    • 3
  1. 1.Materials Analysis DepartmentAMD Saxony Limited Liability Company & Co. KGDresdenGermany
  2. 2.IMECLeuvenBelgium
  3. 3.Flash Technology PredevelopmentInfineon Technologies SC300DresdenGermany

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag London Limited 2005
  • Publisher Name Springer, London
  • eBook Packages Engineering Engineering (R0)
  • Print ISBN 978-1-85233-941-8
  • Online ISBN 978-1-84628-235-5
  • Series Print ISSN 1619-0181
  • Buy this book on publisher's site