Substrate Noise Coupling in RFICs

  • Ahmed Helmy
  • Mohammed Ismail

Part of the Analog Circuits And Signal Processing Series book series (ACSP)

Table of contents

  1. Front Matter
    Pages I-XIV
  2. Ahmed Helmy, Mohammed Ismail
    Pages 1-5
  3. Ahmed Helmy, Mohammed Ismail
    Pages 7-24
  4. Ahmed Helmy, Mohammed Ismail
    Pages 25-42
  5. Ahmed Helmy, Mohammed Ismail
    Pages 43-62
  6. Ahmed Helmy, Mohammed Ismail
    Pages 63-86
  7. Ahmed Helmy, Mohammed Ismail
    Pages 105-112
  8. Back Matter
    Pages 113-120

About this book


Substrate Noise Coupling in RFICs addresses substrate noise coupling in RF and mixed signal ICs when used in a system on chip (SoC) containing digital ICs as well. This trend of integrating RF, mixed signal ICs with large digital ICs is found in many of today's commercial ICs such as single chip Wi-Fi or Bluetooth solutions and is expected to grow rapidly in the future. The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs . This is particularly critical when process feature sizes scale down to the nano meter range.

Substrate Noise Coupling in RFICs reports silicon measurements, new test and noise isolation structures as well as calibration of a design flow used in the design and debug phases of RFICs. A design guide is articulated to be used by RFIC designers to maximize signal isolation and optimize chip floor plan, power and ground domains. Industrial examples of RFICs are given as demonstration vehicles to validate the proposed techniques. Some emphasis is put on the design of on-chip spiral inductors and the impact of the substrate on their performance. To our knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.


RF and mixed signal ICs SoC Substrate Noise algorithm circuit integrated circuit simulation system on chip (SoC) tables

Authors and affiliations

  • Ahmed Helmy
    • 1
  • Mohammed Ismail
    • 2
  1. 1.Dept. Electrical&Computer EngineeringOhio State UniversityColumbus OH 43210USA
  2. 2.Dept. Electrical&Computer Engineering Analog VLSI LabThe Ohio State UniversityColumbus OH 43210USA

Bibliographic information

  • DOI
  • Copyright Information Springer Science+Business Media B.V. 2008
  • Publisher Name Springer, Dordrecht
  • eBook Packages Engineering Engineering (R0)
  • Print ISBN 978-1-4020-8165-1
  • Online ISBN 978-1-4020-8166-8
  • Buy this book on publisher's site