Wafer Scale Integration

  • Earl E. SwartzlanderJr.

Table of contents

  1. Front Matter
    Pages i-xix
  2. Joe E. Brewer
    Pages 1-29
  3. N. R. Strader, J. C. Harden
    Pages 57-118
  4. W. Kent Fuchs, Sy-Yen Kuo
    Pages 119-191
  5. R. M. Lea
    Pages 193-252
  6. Michael J. Little, Jan Grinberg
    Pages 253-317
  7. Jack Raffel, Allan H. Anderson, Glenn H. Chapman
    Pages 319-363
  8. J. F. McDonald, S. Dabral, H. T. Lin
    Pages 365-411
  9. Donald S. Fussell, Miroslaw Malek, Sampath Rangarajan
    Pages 413-472
  10. R. Wayne Johnson, Richard C. Jaeger, Travis N. Blalock
    Pages 473-499
  11. Back Matter
    Pages 501-503

About this book


Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.


Programmable Logic Signal Software VLSI Wafer computer vision development diagnosis integrated circuit interconnect laser logic modeling processor testing

Editors and affiliations

  • Earl E. SwartzlanderJr.
    • 1
  1. 1.TRW Defense Systems GroupRedondo BeachUSA

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag US 1989
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4612-8896-1
  • Online ISBN 978-1-4613-1621-3
  • Buy this book on publisher's site