VLSI Placement and Global Routing Using Simulated Annealing

  • Carl Sechen

Table of contents

  1. Front Matter
    Pages i-xxvi
  2. Carl Sechen
    Pages 1-30
  3. Carl Sechen
    Pages 31-49
  4. Carl Sechen
    Pages 141-179
  5. Carl Sechen
    Pages 229-246
  6. Carl Sechen
    Pages 247-253
  7. Back Matter
    Pages 255-278

About this book


From my B.E.E degree at the University of Minnesota and right through my S.M. degree at M.I.T., I had specialized in solid state devices and microelectronics. I made the decision to switch to computer-aided design (CAD) in 1981, only a year or so prior to the introduction of the simulated annealing algorithm by Scott Kirkpatrick, Dan Gelatt, and Mario Vecchi of the IBM Thomas 1. Watson Research Center. Because Prof. Alberto Sangiovanni-Vincentelli, my UC Berkeley advisor, had been a consultant at IBM, I re­ ceived a copy of the original IBM internal report on simulated annealing approximately the day of its release. Given my background in statistical mechanics and solid state physics, I was immediately impressed by this new combinatorial optimization technique. As Prof. Sangiovanni-Vincentelli had suggested I work in the areas of placement and routing, it was in these realms that I sought to explore this new algorithm. My flJ'St implementation of simulated annealing was for an island-style gate array placement problem. This work is presented in the Appendix of this book. I was quite struck by the effect of a nonzero temperature on what otherwise appears to be a random in­ terchange algorithm.


Modulation Phase Standard VLSI circuit combinatorial optimization computer computer-aided design (CAD) electronics gate array integrated circuit interconnect microelectronics model physics

Authors and affiliations

  • Carl Sechen
    • 1
  1. 1.Yale UniversityUSA

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag US 1988
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4612-8957-9
  • Online ISBN 978-1-4613-1697-8
  • Series Print ISSN 0893-3405
  • Buy this book on publisher's site