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Material Removal

  • Ian W. Boyd
Chapter
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 3)

Abstract

This chapter presents an extensive review of virtually all aspects of laser-induced material removal. The various reaction modes covered here are pyrolytic and photochemical etching, photon-induced ablation, controlled evaporation, and reactive cutting. A compilation of the different combinations of lasers and presursors used in recent years to pattern and develop a wide variety of materials, including not only insulators and polymers, but also metals and semiconductors, is presented here, along with the recorded removal rates.

Keywords

Material Removal Excimer Laser Etch Rate Polyimide Film Cutting Rate 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Recommendation for Further Reading

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Copyright information

© Springer-Verlag Berlin Heidelberg 1987

Authors and Affiliations

  • Ian W. Boyd
    • 1
  1. 1.Department of Electronic and Electrical EngineeringUniversity College LondonLondonUK

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